Description

Devcon 5 Minute® Epoxy Gels, Product Details: Thixotropic, nonmigrating gel adhesive with excellent gap filling properties, High tensile rength, Good solvent resiance, Non-sagging adhesive, Fills gaps to .25 inch, Fa curing for bond tags on machinery and equipment, Teing and Approvals: Chemil resiance was teed by immersion for 30 days at 75 °F, after 7 days room temperature cure; Cured hardness teed according to AM D-2240; Cured density teed according to AM D1002; Compression rength teed according to AM D695; Dielectric rength teed according to AM D149 | Adhesive Tensile Shr: 2,500 psi | Applible Materials: Wood; Mo Metals; Ceramic; Fabric; Concrete; ee | Applitions: Multi-Purpose | Big talog Page#: 2012:167 | Brand: DEVCON | pacity Vol. [Nom]: 50 mL | Chemil Compound: Epoxy | Color: Opaque | Container Size: 50 mL | Country of Origin: US | Dielectric rength: 440 V/mil | Fix Cure Time @ Temp.: 1 h @ 75 °F | Full Cure Time @ Temp.: 16 h @ 75 °F | Gap Fill [Nom]: 1/4 in | Hardness [Nom]: 80 Shore D | MPI talog: YES | MPI talog Page#: 2019:50 | ORMD: NO | Packing Type: Dev-Pak™ | Prop 65: NO | Resiance: Kerosene; Sulfuric Acid-10%; Toluene; Hydrochloric | Special Order: NO | Temp. Range [Max]: 200 °F | Temp. Range [Min]: -40 °F | UNSPSC: 31201600 | Viscosity [Nom]: 150,000 cP | Working Time [Max]: 7 min | Working Time [Min]: 4 min | Working Time [Nom]: 4-7 min | Wt.: 0.2 lb