Description

Devcon 25 Epoxy Plus Adhesives, Product Details: 25-minute working time, Bonds metals, FRP composites, rigid plai, concrete, glass, and wood, Non-corrosive, Teing and Approvals: Cured hardness teed according to AM D-2240; Chemil resiance was teed by immersion for 2 weeks at 42 °C after 7 days cure at 75 °F | Applible Materials: Plaic; Mo Metals; PVC; Aluminum; eel; Cerami | Applitions: Multi-Purpose | Big talog Page#: 2012:167 | Brand: DEVCON | pacity Vol. [Nom]: 50 mL | Chemil Compound: Epoxy | Color: Light Gray | Country of Origin: US | Dielectric rength: 550 V/mil | Full Cure Time @ Temp.: 24 h @ 75 °F | Gap Fill [Nom]: 0.08 in | Hardness [Nom]: 74 Shore D | Hazmat: YES | MPI talog: NO | Packing Type: Dev-Pak™ | Prop 65: NO | Resiance: Kerosene; Sulfuric Acid-10%; Toluene; Hydrochloric | Special Order: NO | Temp. Range [Max]: 200 °F | Temp. Range [Min]: -40 °F | UNSPSC: 31201600 | Viscosity @ Temp. (Nom): 50,000 cP @ 77.0 °F | Wt.: 0.09 lb