Description

Devcon 5 Minute® Epoxy Gels, Product Details: Thixotropic, nonmigrating gel adhesive with excellent gap filling properties, High tensile rength, Good solvent resiance, Non-sagging adhesive, Fills gaps to .25 inch, Fa curing for bond tags on machinery and equipment | Adhesive Tensile Shr: 2,500 psi | Applible Materials: Metal; Ceramic; Wood | Applition Temp. Range [Max]: 200 °F | Applition Temp. Range [Min]: -40°F | Applitions: Bonding Metal, Ceramic, Wood and Vertil Surface | Base Type: Epoxy | Brand: DEVCON | pacity Vol. [Nom]: 400 mL | Chemil Compound: Epoxy | Color: Opaque | Container Size: 400 mL | Country of Origin: US | Dielectric rength: 440 V/mil | Elongation [Nom]: 0.05 | Fix Cure Time @ Temp.: 15 m@72°F | Flash Point [Nom]: 400 °F | Full Cure Time @ Temp.: 7 d @ 75 °F | Gap Fill [Nom]: 1/4 in | Hardness [Nom]: 80 Shore D | Hazmat: NO | Material: Thixotropic Gel | Odor/Scent: Low | Packing Type: rtridge | Physil Form: Gel | Ratio: 1:1 | Resiance: Solvent; Water; Moiure | Special Order: YES | Specific Gravity [Nom]: 1.1- 1.3 | Temp. Range [Max]: 200 °F | Temp. Range [Min]: -40°F | Tensile rength [Nom]: 2,500 psi | Type: Adhesive | Usage: Bonding; Gap Filling | Vol.: 400 mL | Working Time [Nom]: 4-7 min