Description

Devcon HP 250 Epoxy, Product Details: High-performance, gap-filling thixotropic pae for ructural bonding applitions, Superior toughness, impact and chemil resiant, Bonds metals, FRP/SMC composites, phenoli, ainless eel, aluminum, vinyl eers, nylon, PVC, PC, yreni, wood, and rigid plai, Excellent gap fill., WARNING: This product n expose you to chemils including 4-Methyl Imidazole, which is known to the ate of lifornia to use ncer and Methanol which is know to the ate of lifornia to use birth defects or reproductive harm. For more information go to www.P65Warnings..gov | Adhesive Tensile Shr: 3,200 psi | Applible Materials: Aluminum; Brass; Copper; Galvanized eel; Mo Me | Applitions: Multi-Purpose | Base Type: Epoxy | Big talog Page#: 2012:172 | Brand: DEVCON | pacity Vol. [Nom]: 50 mL | Chemil Compound: Epoxy | Color: raw | Container Size: 50 mL | Country of Origin: US | Dielectric rength: 490 V/mil | Elongation [Nom]: 25% | Fix Cure Time @ Temp.: 6 h @ 72 °F | Full Cure Time @ Temp.: 7 d @ 72 °F | Hardness [Nom]: 78 Shore D | Hazmat: YES | Height [Nom]: 3 1/4 in | Length [Nom]: 7 1/4 in | MPI talog Page#: 2019:51 | Material: Thixotropic Pae | Odor/Scent: Low | Packing Type: Dev-Pak™ | Physil Form: Solid | Ratio: 2:1 | Resiance: Chlorinated Solvents; Kerosene; Moiure; Water; W | Special Order: NO | Temp. Range [Max]: 250 °F | Temp. Range [Min]: -67 °F | Tensile rength [Nom]: 3,200 psi | Type: Adhesive | Usage: ructural Bonding | Viscosity [Nom]: 105,000 cP | Vol.: 50 mL | Width [Nom]: 6 in | Working Time [Nom]: 65 min