Description

Devcon 1-Minute® Gel Epoxy, Product Details: Fills gaps, Fa-curing without fixturing, Non-sagging on vertil surfaces, Teing and Approvals: Adhesive tensile shr rength Teed by AM D1002 with an oveap shr run at 0.005″ bond line thickness | Adhesive Tensile Shr: 1,600 psi | Applible Materials: Mo Metals; Glass; Fiberglass; Fabric; Ceramic | Applitions: Multi-Purpose | Big talog Page#: 2012:166 | Brand: DEVCON | pacity Vol. [Nom]: 50 mL | Chemil Compound: Epoxy | Color: Amber | Container Size: 50 mL | Country of Origin: US | Dielectric rength: 490 V/mil | Fix Cure Time @ Temp.: 4 min @ 75 °F | Full Cure Time @ Temp.: 1 h @ 77 °F | Hardness [Nom]: 82 Shore D | Hazmat: YES | MPI talog Page#: 2019:49 | Packing Type: Dev-Pakâ„¢ | Prop 65: NO | Resiance: Ammonia; Kerosene; Sodium Hydroxide-10%; Sulfuric | Special Order: NO | Temp. Range [Max]: 200 °F | Temp. Range [Min]: -40 °F | UNSPSC: 31201600 | Working Time [Min]: 45 sec | Working Time [Nom]: 45 sec | Wt.: 0.25 lb