Description

Devcon 5 Minute® Epoxies, Product Details: Rapid-curing, general-purpose adhesive/enpsulant, Bonds rigid, durable subrates, including glass, metal, cerami, concrete and wood., Forms a clr, hard bond self-leveling liquid in minutes, 100% rctive, no solvents, sily dispenses and mixes in seconds, Dries in 15 minutes, rches functional rength in 1 hour, Good solvent resiance, Teing and Approvals: Chemil resiance was teed by immersion for 30 days at 75 °F, after 7 days room temperature cure; Cured hardness teed according to AM D-2240; Cured density teed according to AM D1002; Compression rength teed according to AM D695; Dielectric rength teed according to AM D149 | Adhesive Tensile Shr: 1,400 psi | Applible Materials: Mo Metals; Fabric; Ceramic; Glass; Concrete; Woo | Applitions: Multi-Purpose | Big talog Page#: 2012:167 | Brand: DEVCON | pacity Vol. [Nom]: 50 mL | Chemil Compound: Epoxy | Color: Light Amber | Container Size: 50 mL | Country of Origin: US | Dielectric rength: 490 V/mil | Fix Cure Time @ Temp.: 1 h @ 75 °F | Full Cure Time @ Temp.: 16 min @ 75 °F | Gap Fill [Nom]: 1/4 in | Hardness [Nom]: 85 Shore D | Hazmat: NO | MPI talog Page#: 2019:49 | Packing Type: Dev-Pak™ | Resiance: Kerosene; Sulfuric Acid-10%; Toluene; Hydrochloric | Temp. Range [Max]: 200 °F | Temp. Range [Min]: -40 °F | UNSPSC: 31201600 | Viscosity [Nom]: 10,000 cP | Working Time [Max]: 6 min | Working Time [Min]: 3 min | Working Time [Nom]: 3-6 min | Wt.: 0.13 lb