Description

Devcon 10 Minute, TM, Epoxy, Product Details: Flexible epoxy provides excellent adhesion to metals and superior peel, impact, and chemil resiance, High shr rength, Excellent chemil resiance to oils, hydrorbons, and fuels, Self leveling liquid for enpsulating components, Bonds dissimilar subrates, Provides good gap fill, Teing and Approvals: Chemil resiance was teed by immersion for 2 weeks at 42 °C after 7 days cure at 75 °F; Cured hardness teed according to AM D2240; T-Peel rength teed according to AM D1876, 10″/min on 0.030″ abraded eel; Tensile shr rength teed according to AM D1002, 0.007″ bond line using 0.060″ subrate thickness at 48-hr cure at 75°F; Ultimate elongation and ultimate tensile rength (po-cure 2-hr at 180 °F) teed according to AM D638 | Adhesive Tensile Shr: 2,400 psi | Applible Materials: Aluminum; Brass; Copper; Galvanized eel; Mo Me | Big talog Page#: 2012:166 | Brand: DEVCON | pacity Vol. [Nom]: 50 mL | Color: Black | Container Size: 50 mL | Country of Origin: US | Dielectric rength: 800 V/mil | Fix Cure Time @ Temp.: 20 min @ 72 °F | Full Cure Time @ Temp.: 7 d @ 70 °F | Hardness [Nom]: 75 Shore D | Hazmat: NO | MPI talog: YES | MPI talog Page#: 2019:49 | Packing Type: Dev-Pakâ„¢ | Resiance: Chlorinated Solvents; Kerosene; Moiure; Water; W | Temp. Range [Max]: 200 °F | Temp. Range [Min]: -67 °F | Viscosity [Nom]: 90,000 cP | Working Time [Nom]: 10 min | Wt.: 0.17 lb