Description

Devcon 10 Minute, TM, Epoxy, Product Details: Flexible epoxy provides excellent adhesion to metals and superior peel, impact, and chemil resiance, High shr rength, Excellent chemil resiance to oils, hydrorbons, and fuels, Self leveling liquid for enpsulating components, Bonds dissimilar subrates, Provides good gap fill, Teing and Approvals: Chemil resiance was teed by immersion for 2 weeks at 42 °C after 7 days cure at 75 °F; Ultimate elongation and ultimate tensile rength (po-cure 2-hr at 180 °F) teed according to AM D638; Tensile shr rength teed according to AM D1002, 0.007″ bond line using 0.060″ subrate thickness at 48-hr cure at 75°F; T-Peel rength teed according to AM D1876, 10″/min on 0.030″ abraded eel; Cured hardness teed according to AM D2240 | Adhesive Tensile Shr: 2,400 psi | Applible Materials: Mo Metals; Aluminum; Copper; eel; Brass; Galva | Big talog Page#: 2012:166 | Brand: DEVCON | pacity Vol. [Nom]: 50 mL | Color: Clr | Country of Origin: US | Fix Cure Time @ Temp.: 20 min @ 75 °F | Full Cure Time @ Temp.: 7 d @ 70 °F | Hardness [Nom]: 75 Shore D | Hazmat: NO | Packing Type: Dev-Pakâ„¢ | Temp. Range [Max]: 200 °F | Temp. Range [Min]: -67 °F | UNSPSC: 31201600 | Viscosity [Nom]: 80,000 cP | Wt.: 0.17 lb