Description

Devcon® DFense Blok, TM, Wring Compound, Product Details: Bd-filled epoxy compound formulated to outla and outperform traditional wring compounds, A revolutionary polymer that offers exceptional adhesion characterii and superior wr, sliding abrasion, side impact and drop impact resiance, Targeted for use in facilities processing abrasive subances, whether dry or slurry | Applitions: Processing Equipment; Fan Blades; Scrubbers; Pipe | Brand: DEVCON | pacity Wt. [Nom]: 30 lb | Chemil Compound: Alumina | Color: Gray | Container Size: 30 lb | Country of Origin: US | Fix Cure Time @ Temp.: 4 h @ 75°F | Full Cure Time @ Temp.: 7 d @ 75°F | Hardness [Nom]: 77D | Hazmat: YES | MPI talog: NO | Odor/Scent: None | Packing Type: Container | Physil Form: Compound | Prop 65: NO | Resiance: Chemil;Abrasion;Impact;Wr | Specific Gravity [Nom]: 2.21 | Temp. Range [Max]: 300° F | Temp. Range [Min]: 140° F | Tensile rength [Nom]: 2,616 psi | Type: Cermamic Bd-Filled Epoxy Compound