Description

Devcon Aluminum Liquid (F-2), Product Details: Aluminum-filled pourable epoxy for making molds, patterns, and holding fixtures, n be machined, drilled, or tapped, Low viscosity provides accurate reproduction of mold details and of delite or intrite parts, Qualifies under MMM-A-1754, 75-minute working time, Teing and Approvals: Chemil resiance was teed by immersion for 30 days at 75 °F, after 7 days room temperature cure | Adhesive Tensile Shr: 2,700 psi | Applible Materials: Aluminum | Applitions: Multi-Purpose | Big talog Page#: 2012:167 | Brand: DEVCON | pacity Vol. [Nom]: 1 lb | pacity Wt. [Nom]: 1 lb | Chemil Compound: Epoxy | Color: Aluminum | Compressive rength: 9,820 psi | Country of Origin: US | Dielectric rength: 100 V/mil | Full Cure Time @ Temp.: 16 h @ 75 °F | Gap Fill [Nom]: 1 in | Hardness [Nom]: 85 Shore D | Hazmat: YES | MPI talog Page#: 2019:50 | Packing Type: Kit | Physil Form: Liquid | Prop 65: NO | Resiance: Chlorinated Solvents; Hydrochloric Acid-10%; Keros | Special Order: NO | Temp. Range [Max]: 250 °F | Tensile rength [Nom]: 5,000 psi | UNSPSC: 31201600 | Viscosity [Nom]: 20,000 cP | Working Time [Max]: 75 min | Wt.: 1.5 lb